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(Pocket-lint) – Honor will soon launch its first foldable smartphone. And while there is no actual confirmation about the phone yet, the manufacturer has at least confirmed its existence.
However, thanks to a recent leak, it looks like we know which brain is going to power the next flexible device.
It should come as no surprise to learn that a phone – described by the manufacturer as a “flagship” – will feature a brand new Snapdragon 8 Gen 1 processor.
This would make it one of the first phones to feature the next-generation Qualcomm platform and, most importantly, the first foldable to use that particular chipset.
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This could give the Honor Magic V a performance advantage over all Flexible smartphones launched in 2021. At least, in theory.
The leak comes from a social media handle on Weibo, which has an image of a slide during a presentation on the Honor Magic V which clearly shows that the next-gen chip from Snapdragon will be powering the device.
As with any unofficial leak – as can be inferred from the information – there is no guarantee that the information is accurate.
However, we would be very surprised if Honor didn’t pack an 8-series Snapdragon processor in the flagship phone. Be it the current Snapdragon 888 or the first of the famous Series 8 chipsets.
Honor hasn’t given an official launch date for the Magic V yet, but it has officially teased it, which means it may not be too far from being revealed now.
Written by Cam Bunton. originally published on ,